ULSI Semiconductor Technology Atlas

FOREWORD ix

PREFACE xi

PART I 1

1 Microelectronics and Microscopy 3

2 ULSI Process Technology 36

3 Applications of TEM for Construction Analysis 61

4 TEM Sample Preparation Techniques 90

PART II 141

5 Ion Implantation and Substrate Defects 143

6 Dielectrics and Isolation 179

7 Silicides, Polycide, and Salicide 256

8 Metallization and Interconnects 287

PART III 343

9 ULSI Devices I: DRAM Cell with Planar Capacitor 345

10 ULSI Devices II: DRAM Cell with Stacked Capacitor 365

11 ULSI Devices III: DRAM Cell with Trench Capacitor 399

12 ULSI Devices IV: SRAM 445

PART IV 475

13 TEM in Failure Analysis 477

14 Novel Devices and Materials 526

15 TEM in Under Bump Metallization (UBM) and Advanced Electronics Packaging Technologies 558

16 High-Resolution TEM in Microelectronics 609

INDEX 647