Integrated Circuit Failure Analysis: A Guide to Preparation TechniquesISBN: 978-0-471-97401-7
Hardcover
190 pages
February 1998
 This is a Print-on-Demand title. It will be printed specifically to fill your order. Please allow an additional 10-15 days delivery time. The book is not returnable.
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Purpose and Importance of Preparatory Semiconductor Analysis.
Opening the Package: Chip Insulation.
Wet Chemical Etching Procedures for Removing Layers of the ChipStructure.
Crystallographic Etching in the Silicon.
Dry Etching in the Plasma.
Microsectioning Technology, Metallography.
Outlook.
Appendices.
Index.
Opening the Package: Chip Insulation.
Wet Chemical Etching Procedures for Removing Layers of the ChipStructure.
Crystallographic Etching in the Silicon.
Dry Etching in the Plasma.
Microsectioning Technology, Metallography.
Outlook.
Appendices.
Index.
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