Integrated Circuit, Hybrid, and Multichip Module Package Design Guidelines: A Focus on ReliabilityISBN: 978-0-471-59446-8
Hardcover
464 pages
March 1994
 This is a Print-on-Demand title. It will be printed specifically to fill your order. Please allow an additional 10-15 days delivery time. The book is not returnable.
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Design for Reliability Concepts.
Starting the Design Process.
Substrates.
Wire and Wirebonds.
Tape Automated Bonding.
Flip-Chip Bonding.
Attachment.
Case.
Leads.
Lead Seals.
Lid Seal and Lid.
Index.
Starting the Design Process.
Substrates.
Wire and Wirebonds.
Tape Automated Bonding.
Flip-Chip Bonding.
Attachment.
Case.
Leads.
Lead Seals.
Lid Seal and Lid.
Index.
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