Quality Conformance and Qualification of Microelectronic Packages and InterconnectsISBN: 978-0-471-59436-9
Paperback
496 pages
December 1994
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Three-Dimensional Stacked Dies.
Cofired Ceramic Substrates.
Organic Laminated Substrates and Chip-on-Board.
High-Density Interconnects and Deposited Dielectrics.
Wire and Wirebonds.
Tape Automated Bonds.
Flip-Chip Bonds.
Device and Substrate Attachment.
Cases.
Leads.
Lead Seals.
Lid Seals.
Material and Product Evaluation Methods.
Rework Methods.
Bibliography.
Index.
Cofired Ceramic Substrates.
Organic Laminated Substrates and Chip-on-Board.
High-Density Interconnects and Deposited Dielectrics.
Wire and Wirebonds.
Tape Automated Bonds.
Flip-Chip Bonds.
Device and Substrate Attachment.
Cases.
Leads.
Lead Seals.
Lid Seals.
Material and Product Evaluation Methods.
Rework Methods.
Bibliography.
Index.
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