SemiConductor Wafer Bonding: Science and TechnologyISBN: 978-0-471-57481-1
Hardcover
320 pages
December 1998
 This is a Print-on-Demand title. It will be printed specifically to fill your order. Please allow an additional 10-15 days delivery time. The book is not returnable.
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Basics of Interactions Between Flat Surfaces.
Influence of Particles, Surface Steps, and Cavities.
Surface Preparation and Room-Temperature Wafer Bonding.
Thermal Treatment of Bonded Wafer Pairs.
Thinning Procedures.
Electrical Properties of Bonding Interfaces.
Stresses in Bonded Wafers.
Bonding of Dissimilar Materials.
Bonding of Structured Wafers.
Mainstream Applications.
Emerging and Future Applications.
Index.
Influence of Particles, Surface Steps, and Cavities.
Surface Preparation and Room-Temperature Wafer Bonding.
Thermal Treatment of Bonded Wafer Pairs.
Thinning Procedures.
Electrical Properties of Bonding Interfaces.
Stresses in Bonded Wafers.
Bonding of Dissimilar Materials.
Bonding of Structured Wafers.
Mainstream Applications.
Emerging and Future Applications.
Index.
Related Titles
Electrochemistry
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