Textbook
Advanced Electronic Packaging, 2nd EditionISBN: 978-0-471-46609-3
Hardcover
840 pages
February 2006, ©2006, Wiley-IEEE Press
This is a Print-on-Demand title. It will be printed specifically to fill your order. Please allow an additional 15-20 days delivery time. The book is not returnable.
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Topics covered include packaging materials and applications, analytical techniques for materials, fabrication technologies in packaging, substrate technologies, basic electrical, mechanical, and thermal considerations, package design, modeling and simulation, integrated passive devices, MEMS packaging, RF and microwave packaging, reliability considerations, cost evaluation and analysis, and 3-dimensional packaging.