Preventing Thermal Cycling and Vibration Failures in Electronic EquipmentISBN: 978-0-471-35729-2
Hardcover
304 pages
July 2001
 This is a Print-on-Demand title. It will be printed specifically to fill your order. Please allow an additional 10-15 days delivery time. The book is not returnable.
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Preface.
Symbols.
Physics of Failure In Electronic Systems.
Thermal Expansion Displacements, Forces, and Stresses.
Vibration of Beams and Other Simple Structures.
Vibration of Printed Circuit Boards and Flat Plates.
Estimating Fatigue Life in Thermal Cycling and VibrationEnvironments.
Octave Rule, Snubbers, Dampers, and Isolation for PreventingVibration Damage to Electronic Systems.
Displacements, Forces, and Stresses in Axial Leaded ComponentWires Due to Thermal Expansions.
Designing Electronic Equipment for Sinusoidal Vibration.
Assessment of Random Vibration on Electronic Design.
Combining Fatigue Damage for Random Vibration and Thermal Cycling.
Thermal Cycling Failures in Surface-Mounted Components.
Stresses and Fatigue Life in Component Lead Wires and SolderJoints Due to Dynamic Forces and PCB Displacements.
Fatigue Life of Long Components, Tall Components, and SmallComponents Mounted on PCBs.
Wear and Interface Surface Fretting Corrosion in ElectricalConnectors.
Case Histories of Failures and Failure Analyses.
Bibliography.
Index.
Symbols.
Physics of Failure In Electronic Systems.
Thermal Expansion Displacements, Forces, and Stresses.
Vibration of Beams and Other Simple Structures.
Vibration of Printed Circuit Boards and Flat Plates.
Estimating Fatigue Life in Thermal Cycling and VibrationEnvironments.
Octave Rule, Snubbers, Dampers, and Isolation for PreventingVibration Damage to Electronic Systems.
Displacements, Forces, and Stresses in Axial Leaded ComponentWires Due to Thermal Expansions.
Designing Electronic Equipment for Sinusoidal Vibration.
Assessment of Random Vibration on Electronic Design.
Combining Fatigue Damage for Random Vibration and Thermal Cycling.
Thermal Cycling Failures in Surface-Mounted Components.
Stresses and Fatigue Life in Component Lead Wires and SolderJoints Due to Dynamic Forces and PCB Displacements.
Fatigue Life of Long Components, Tall Components, and SmallComponents Mounted on PCBs.
Wear and Interface Surface Fretting Corrosion in ElectricalConnectors.
Case Histories of Failures and Failure Analyses.
Bibliography.
Index.
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